SUGAHARA Tohru

Profile

Degree

• 2005/03
• 2009/03

External Career

Campus Career

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Educational Activities

Classes

• Instrumental Analysis for Inorganic Materials
• Inorganic Chemistry Ⅰ
• Exercise in Inorganic Chemistry
• Inorganic Materials Science Ⅰ
• Science and Applicaion for Inorganic materials
• Nano Materials Processing

Research Activities

Research Field

• Research Field:Inorganic materials and properties

Association Memberships

THE JAPAN SOCIETY OF APPLIED PHYSICS

Papers

• Analysis of the crystal phase and orientation of nanocrystals and nanorods of MoOx thin films
  Author : Yukiko Hirose; Jun-ichi Nakamura; Nobuyuki Harada; Katsuaki Suganuma; Tohru Sugahara
  Journal : Nano-Structures & Nano-Objects
  Publication Date : 2023/02
• Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip
  Author : Dongjin Kim; Shijo Nagao; Chuantong Chen; Naoki Wakasugi; Yasuyuki Yamamoto; Aiji Suetake; Tetsu Takemasa; Tohru Sugahara; Katsuaki Suganuma
  Journal : IEEE Transactions on Power Electronics
  Publication Date : 2021/05
• Effects of additive NH3with citric acid in the precursor and controlling the deposited thickness for growing molybdenum oxide crystals and nanorods
  Author : Yukiko Hirose; Tohru Sugahara; Jun Ichi Nakamura; Nobuyuki Harada; Katsuaki Suganuma
  Journal : Materials Chemistry Frontiers
  Publication Date : 2021/01
• Formation of Metal-Organic Decomposition Derived Nanocrystalline Structure Titanium Dioxide by Heat Sintering and Photosintering Methods for Advanced Coating Process, and Its Volatile Organic Compounds’ Gas-Sensing Properties
  Author : Tohru Sugahara; Leila Alipour; Yukiko Hirose; Yusufu Ekubaru; Jun-ichi Nakamura; Hironobu Ono; Nobuyuki Harada; Katsuaki Suganuma
  Journal : ACS Applied Electronic Materials
  Publication Date : 2020/06
• Effects of microstructure of Ni barrier on bonding interface diffusion behaviors of Bi–Te-based thermoelectric material
  Author : Ekubaru Yusufu; Tohru Sugahara; Michio Okajima; Shutaro Nambu; Katsuaki Suganuma
  Journal : Journal of Alloys and Compounds
  Publication Date : 2020/03
• Effect of W content in Co-W-P metallization on both oxidation resistance and resin adhesion
  Author : Tomohito Iwashige; Takeshi Endo; Kazuhiko Sugiura; Kazuhiro Tsuruta; Yuichi Sakuma; Yukinori Oda; Chuantong Chen; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma
  Journal : Journal of Materials Science
  Publication Date : 2020/01
• Fabrication and Characterization of Ultra-Lightweight, Compact, and Flexible Thermoelectric Device Based on Highly Refined Chip Mounting
  Author : Yusufu Ekubaru; Tohru Sugahara; Kenzo Ibano; Aiji Suetake; Maki Tsurumoto; Noriko Kagami; Katsuaki Suganuma
  Journal : Advanced Materials Technologies
  Publication Date : 2020
• Development of high-strength and superior thermal shock-resistant GaN/DBA die attach structure with Ag sinter joining by thick Ni metallization
  Author : D. Kim; C. Chen; S. Noh; S.-J. Lee; Z. Zhang; Y. Kimoto; T. Sugahara; K. Suganuma
  Journal : Microelectronics Reliability
  Publication Date : 2019/09
• Ag particles for sinter bonding: Flakes or spheres?
  Author : Jeyun Yeom; Shijo Nagao; Chuantong Chen; Tohru Sugahara; Hao Zhang; Chanyang Choe; Cai Fu Li; Katsuaki Suganuma
  Journal : Applied Physics Letters
  Publication Date : 2019/06
• Ag particles for sinter bonding: Flakes or spheres?
  Author : Jeyun Yeom; Shijo Nagao; Chuantong Chen; Tohru Sugahara; Hao Zhang; Chanyang Choe; Cai-Fu Li; Katsuaki Suganuma
  Journal : APPLIED PHYSICS LETTERS
  Publication Date : 2019/06
• Alloying and Embedding of Cu-Core/Ag-Shell Nanowires for Ultrastable Stretchable and Transparent Electrodes
  Author : Bowen Zhang; Wanli Li; Masaya Nogi; Chuantong Chen; Yang Yang; Tohru Sugahara; Hirotaka Koga; Katsuaki Suganuma
  Journal : ACS Applied Materials and Interfaces
  Publication Date : 2019/05
• Thermal stability improvement of sintered Ag die-attach materials by addition of transition metal compound particles
  Author : Kazuhiko Sugiura; Tomohito Iwashige; Kazuhiro Tsuruta; Chuantong Chen; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma
  Journal : Applied Physics Letters
  Publication Date : 2019/04
• GaN micro-heater chip for power cycling of die attach modules with Ag sinter joint and high temperature solder
  Author : Dongjin Kim; Shijo Nagao; Chuantong Chen; Yasuyuki Yamamoto; Naoki Wakasugi; Yukiharu Kimoto; Tetsu Takemasa; Tohru Sugahara; Katsuaki Suganuma
  Journal : PCIM Europe Conference Proceedings
  Publication Date : 2019
• In situ TEM observation of sintered Ag die-attach layer with added tungsten carbide particles while heating to high temperature
  Author : Kazuhiko Sugiura; Tomohito Iwashige; Kazuhiro Tsuruta; Chuantong Chen; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma
  Journal : Japanese Journal of Applied Physics
  Publication Date : 2019
• Thermal shock reliability of a GaN die-attach module on DBA substrate with Ti/Ag metallization by using micron/submicron Ag sinter paste
  Author : Dongjin Kim; Chuantong Chen; Chun Pei; Zheng Zhang; Shijo Nagao; Aiji Suetake; Tohru Sugahara; Katsuaki Suganuma
  Journal : Japanese Journal of Applied Physics
  Publication Date : 2019
• Fabrication with Semiconductor Packaging Technologies and Characterization of a Large-Scale Flexible Thermoelectric Module
  Author : Sugahara, T; Ekubaru, Y; Nong, N.V; Kagami, N; Ohata, K; Hung, L.T; Okajima, M; Nambu, S; Suganuma, K
  Publication Date : 2019
• Improvement of the Bond Strength of Ag Sinter-Joining on Electroless Ni/Au Plated Substrate by a One-Step Preheating Treatment
  Author : Chen, C; Zhang, Z; Choe, C; Kim, D; Noh, S; Sugahara, T; Suganuma, K
  Journal : Journal of Electronic Materials
  Publication Date : 2019
• Nearly perfect Ag joints prepared by Ag stress-migration-bonding (SMB) process
  Author : Hao Zhang; Seungjun Noh; Norio Asatani; Yukiharu Kimoto; Aiji Suetake; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma
  Journal : 3D-PEIM 2018 - 2nd International Symposium on 3D Power Electronics Integration and Manufacturing
  Publication Date : 2018/11
• Heat-resistant packaging technology for wide bandgap power devices and thermal reliability testing
  Author : K. Suganuma; H. Zhang; S. Nagao; C. Chen; T. Sugahara; A. Shimoyama; A. Suetake
  Journal : 2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
  Publication Date : 2018/10
• Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate
  Author : Fu Long Sun; Li Yin Gao; Zhi Quan Liu; Hao Zhang; Tohru Sugahara; Shijo Nagao; Katsuaki Suganuma
  Journal : Journal of Materials Science and Technology
  Publication Date : 2018/10
• Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure
  Author : Dongjin Kim; Chuantong Chen; Aiji Suetake; Chanyang Choe; Tohru Sugahara; Shijo Nagao; Katsuaki Suganuma
  Journal : Microelectronics Reliability
  Publication Date : 2018/09
• The comprehensive effects of visible light irradiation on silver nanowire transparent electrode
  Author : Jun Wang; Jinting Jiu; Shuye Zhang; Tohru Sugahara; Shijo Nagao; Katsuaki Suganuma; Peng He
  Journal : Nanotechnology
  Publication Date : 2018/08
• A nearly-perfect Ag joints prepared by novel Ag to Ag direct bonding
  Author : Hao Zhang; Seungjun Noh; Norio Asatani; Yukiharu Kimoto; Aiji Suetake; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma
  Journal : 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
  Publication Date : 2018/06
• Ethanol gas sensing performance of high-dimensional fuzz metal oxide nanostructure
  Author : Kenzo Ibano; Yoshihiro Kimura; Tohru Sugahara; Heun Tae Lee; Yoshio Ueda
  Journal : Japanese Journal of Applied Physics
  Publication Date : 2018/04
• Strongly anisotropic thermal conductivity and adequate breathability of bilayered films for heat management of on-skin electronics
  Author : Tianle Zhou; Hao Wei; Huaping Tan; Xin Wang; Haibo Zeng; Xiaoheng Liu; Shijo Nagao; Hirotaka Koga; Masaya Nogi; Tohru Sugahara; Katsuaki Suganuma
  Journal : 2D Materials
  Publication Date : 2018/04
• Microstructural Investigation on the Mechanism of Ag Thin Film Bonding
  Author : Z. Liu; H. Zhang; C. Li; T. Sugahara; S. Nagao; K. Suganuma
  Publication Date : 2018/03
• Thermal Stable Ag-Ag Joints Bonded by Ultrasound-assisted Stress Migration Bonding
  Author : H. Zhang; N. Asatani; Y. Kimoto; A. Suetake; S. Nagao; T. Sugahara; K. Suganuma
  Publication Date : 2018/03
• Nanoridge patterns on polymeric film by a photodegradation copying method for metallic nanowire networks
  Author : Jun Wang; Shuye Zhang; Zhiyuan Shi; Jinting Jiu; Chunhui Wu; Tohru Sugahara; Shijo Nagao; Katsuaki Suganuma; Peng He
  Journal : RSC Advances
  Publication Date : 2018
• Packaging material technology for wide band gap power devices and its performance/reliability evaluation
  Author : K. Suganuma; N. Sato; A. Suetake; C. Choe; T. Sugahara; S. Nagao; C. Chen
  Journal : ECS Transactions
  Publication Date : 2018
• Highly Conductive Stretchable Wirings Composed of Ag Foils and Elastomer
  Author : Li, C.-F; Zhang, B; Suganuma, K; Zhang, H; Sugahara, T; Li, W; Liu, Z.-Q
  Publication Date : 2018
• Thin Film of Amorphous Zinc Hydroxide Semiconductor for Optical Devices with an Energy-Efficient Beneficial Coating by Metal Organic Decomposition Process
  Author : Karakawa, M; Sugahara, T; Hirose, Y; Suganuma, K; Aso, Y
  Publication Date : 2018
• Investigation on the melting and tensile properties of Bi-containing SAC105 lead-free solder alloys
  Author : Yinbo Chen; Yuzhou Gao; Zhi Quan Liu; Hao Zhang; Tohru Sugahara; Shijo Nagao; Katsuaki Suganuma
  Journal : 18th International Conference on Electronic Packaging Technology, ICEPT 2017
  Publication Date : 2017/09
• Ag sinter joining and wiring for high power electronics
  Author : K. Suganuma; N. Asatani; K. Kimoto; A. Suetake; H. Zhang; S. Nagao; T. Sugahara
  Journal : 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017
  Publication Date : 2017/07
• Die Bonding Performance Using Bimodal Cu Particle Paste Under Different Sintering Atmospheres
  Author : Yue Gao; Hao Zhang; Wanli Li; Jinting Jiu; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma
  Journal : JOURNAL OF ELECTRONIC MATERIALS
  Publication Date : 2017/07
• Printable and Flexible Copper-Silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance
  Author : Wanli Li; Dawei Hu; Lingying Li; Cai-Fu Li; Jinting Jiu; Chuantong Chen; Toshiyuki Ishina; Tohru Sugahara; Katsuaki Suganuma
  Journal : ACS APPLIED MATERIALS & INTERFACES
  Publication Date : 2017/07
• Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices
  Author : Chuantong Chen; Shijo Nagao; Katsuaki Suganuma; Jinting Jiu; Tohru Sugahara; Hao Zhang; Tomohito Iwashige; Kazuhiko Sugiura; Kazuhiro Tsuruta
  Journal : ACTA MATERIALIA
  Publication Date : 2017/05
• Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design
  Author : Chuantong Chen; Shijo Nagao; Hao Zhang; Jinting Jiu; Tohru Sugahara; Katsuaki Suganuma; Tomohito Iwashige; Kazuhiko Sugiura; Kazuhiro Tsuruta
  Journal : JOURNAL OF ELECTRONIC MATERIALS
  Publication Date : 2017/03
• Thermal Stability Improvement of Sintered Ag Die-attach Material
  Author : 杉浦 和彦; 岩重 朝仁; 河合 潤; 鶴田 和弘; 陳伝 トウ; 長尾 至成; 張 昊; 菅原 徹; 菅沼 克昭
  Journal : MES
  Publication Date : 2017
• Thermal stability improvement of sintered Ag materials by addition of tungsten compound particles
  Author : 杉浦 和彦; 岩重 朝仁; 河合 潤; 鶴田 和弘; Chuantong Chen; 長尾 至成; Hao Zhang; 菅原 徹; 菅沼 克昭
  Journal : Proceedings of JIEP Annual Meeting
  Publication Date : 2017
• High-temperature reliability using metal-sinter die-attach for SiC power device
  Author : 関 伸弥; 下山 章夫; 張 昊; 藤田 浩史; 山村 圭司; 村松 哲郎; 菅原 徹; 長尾 至成; 菅沼 克昭
  Journal : Proceedings of JIEP Annual Meeting
  Publication Date : 2017
• Stability improvement of silver sintering process for highly thermal-resist power device packaging
  Author : 下山 章夫; 関 伸弥; 張 昊; 藤田 浩史; 山村 圭司; 村松 哲郎; 菅原 徹; 長尾 至成; 菅沼 克昭
  Journal : Proceedings of JIEP Annual Meeting
  Publication Date : 2017
• Silver Sinter Joining for WBG Die-attach
  Author : Katsuaki Suganuma; Shijo Nagao; Torhu Sugahara; Hao Zhang; Chuantong Chen; Toshiyuki Ishina; Jinting Jiu
  Journal : 2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP)
  Publication Date : 2017
• Prominent interface structure and bonding material of power module for high temperature operation
  Author : Kazuhiko Sugiura; Tomohito Iwashige; Jun Kawai; Kazuhiro Tsuruta; Chuantong Chen; Shijo Nagao; Hao Zhang; Tohru Sugahara; Katsuaki Suganuma; Seigo Kurosaka; Yuichi Sakuma; Yukinori Oda
  Journal : Proceedings of the International Symposium on Power Semiconductor Devices and ICs
  Publication Date : 2017
• Modifying the valence state of molybdenum in the efficient oxide buffer layer of organic solar cells via a mild hydrogen peroxide treatment
  Author : Shuren Cong; Afshin Hadipour; Tohru Sugahara; Tingting Wei; Jinting Jiu; Samaneh Ranjbar; Yukiko Hirose; Makoto Karakawa; Shijo Nagao; Tom Aernouts; Katsuaki Suganuma
  Journal : JOURNAL OF MATERIALS CHEMISTRY C
  Publication Date : 2017/01
• Composition of Copper Nanowires and Preparation of Transparent Conductive Film by Intense Pulse Light Sintering
  Author : Yue Gao; Toshiyuki Ishina; Ding Su; Jiu Jinting; Tohru Sugahara; Shijo Nagao; Katsuaki Suganuma
  Journal : JOURNAL OF THE JAPAN INSTITUTE OF METALS AND MATERIALS
  Publication Date : 2017
• High temperature SiC power device realized by electroless plating diffusion barrier for Ag sinter die-attach
  Author : S. Seki; A. Shimoyama; H. Zhang; S. Kurosaka; T. Sugioka; H. Fujita; K. Yamamura; T. Muramatsu; T. Sugahara; S. Nagao; K. Suganuma
  Journal : 2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP)
  Publication Date : 2017
• Effect of size and shape of Ag particles for mechanical properties of sintered Ag joints evaluated by micro-compression test
  Author : Chuantong Chen; Shijo Nagao; Tohru Sugahara; Hao Zhang; Jinting Jiu; Katsuaki Suganuma; Tomohito Iwashige; Kazuhiko Sugiura; Kazuhiro Tsuruta
  Journal : 2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP)
  Publication Date : 2017
• First Failure Point of a SiC Power Module with Sintered Ag Die-Attach on Reliability Tests
  Author : Kazuhiko Sugiura; Tomohito Iwashige; Kazuhiro Tsuruta; Chuantong Chen; Shijo Nagao; Hao Zhang; Tohru Sugahara; Katsuaki Suganuma
  Journal : 2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP)
  Publication Date : 2017
• Silver Sinter Joining for WBG Die-attach
  Author : Katsuaki Suganuma; Shijo Nagao; Torhu Sugahara; Hao Zhang; Chuantong Chen; Toshiyuki Ishina; Jinting Jiu
  Journal : 2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP)
  Publication Date : 2017
• Self-healing of cracks in Ag joining layer for die-attachment in power devices
  Author : Chuantong Chen; Shijo Nagao; Katsuaki Suganuma; Jinting Jiu; Hao Zhang; Tohru Sugahara; Tomohito Iwashige; Kazuhiko Sugiura; Kazuhiro Tsuruta
  Journal : APPLIED PHYSICS LETTERS
  Publication Date : 2016/08
• Diverse Adsorption/Desorption Abilities Originating from the Nanostructural Morphology of VOC Gas Sensing Devices Based on Molybdenum Trioxide Nanorod Arrays
  Author : Shuren Cong; Tohru Sugahara; Tingting Wei; Jinting Jiu; Yukiko Hirose; Shijo Nagao; Katsuaki Suganuma
  Journal : ADVANCED MATERIALS INTERFACES
  Publication Date : 2016/07
• Diverse Adsorption/Desorption Abilities Originating from the Nanostructural Morphology of VOC Gas Sensing Devices Based on Molybdenum Trioxide Nanorod Arrays
  Author : Shuren Cong; Tohru Sugahara; Tingting Wei; Jinting Jiu; Yukiko Hirose; Shijo Nagao; Katsuaki Suganuma
  Journal : ADVANCED MATERIALS INTERFACES
  Publication Date : 2016/07
• Dry-growth of silver single-crystal nanowires from porous Ag structure
  Author : Chuantong Chen; Shijo Nagao; Jinting Jiu; Hao Zhang; Tohru Sugahara; Katsuaki Suganuma
  Journal : APPLIED PHYSICS LETTERS
  Publication Date : 2016/06
• Die-attaching silver paste based on a novel solvent for high-power semiconductor devices
  Author : Jinting Jiu; Hao Zhang; Shijo Nagao; Tohru Sugahara; Noriko Kagami; Youji Suzuki; Yasuyuki Akai; Katsuaki Suganuma
  Journal : JOURNAL OF MATERIALS SCIENCE
  Publication Date : 2016/04
• One-Step Fabrication of Stretchable Copper Nanowire Conductors by a Fast Photonic Sintering Technique and Its Application in Wearable Devices
  Author : Su Ding; Jinting Jiu; Yue Gao; Yanhong Tian; Teppei Araki; Tohru Sugahara; Shijo Nagao; Masaya Nogi; Hirotaka Koga; Katsuaki Suganuma; Hiroshi Uchida
  Journal : ACS APPLIED MATERIALS & INTERFACES
  Publication Date : 2016/03
• Facile fabrication of stretchable Ag nanowire/polyurethane electrodes using high intensity pulsed light
  Author : Yang Yang; Su Ding; Teppei Araki; Jinting Jiu; Tohru Sugahara; Jun Wang; Jan Vanfleteren; Tsuyoshi Sekitani; Katsuaki Suganuma
  Journal : NANO RESEARCH
  Publication Date : 2016/02
• Backside metalization of SiC power devices for high heat-resistant packaging
  Author : 関 伸弥; 下山 章夫; 張 昊; 村松 哲郎; 菅原 徹; 長尾 至成; 菅沼 克昭
  Journal : MES
  Publication Date : 2016
• Investigation on mass-production-ready sinter die-attach process for next-generation semiconductor power devices
  Author : 下山 章夫; 張 昊; 関 伸弥; 村松 哲郎; 菅原 徹; 長尾 至成; 菅沼 克昭
  Journal : MES
  Publication Date : 2016
• Ag Sinter Joining for WBG Interconnects
  Author : Katsuaki Suganuma; Shoji Nagao; Torhu Sugahara; Hao Zhang; Jinting Jiu
  Journal : 2016 INTERNATIONAL SYMPOSIUM ON 3D POWER ELECTRONICS INTEGRATION AND MANUFACTURING (3D-PEIM)
  Publication Date : 2016
• Silver Sinter Joining and Stress Migration Bonding for WBG Die-attach
  Author : K. Suganuma; S. Nagao; T. Sugahara; E. Yokoi; H. Zhang; J. Jiu
  Journal : 2016 INTERNATIONAL SYMPOSIUM ON 3D POWER ELECTRONICS INTEGRATION AND MANUFACTURING (3D-PEIM)
  Publication Date : 2016
• A NEW MICRO-SILVER PASTE FOR HIGH POWER SEMICONDUCTOR DEVICES
  Author : Jinting Jiu; Hao Zhang; Shijo Nagao; Tohru Sugahara; Noriko Kagami; Katsuaki Suganuma
  Journal : 2016 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC)
  Publication Date : 2016
• Low-stress design for SiC power modules with sintered porous Ag interconnection
  Author : Chuantong Chen; Shijo Nagao; Hao Zhang; Tohru Sugahara; Katsuaki Suganuma; Tomohito Iwashige; Kazuhiko Sugiura; Kazuhiro Tsuruta
  Journal : 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
  Publication Date : 2016
• Thermostable electroless plating optimized for Ag sinter die-attach realizing high T-J device packaging
  Author : Hao Zhang; Shijo Nagao; Seigo Kurosaka; Hiroshi Fujita; Keiji Yamamura; Akio Shimoyama; Shinya Seki; Tohru Sugahara; Katsuaki Suganuma
  Journal : 2016 6TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)
  Publication Date : 2016
• Metastable pitting and its correlation with electronic properties of passive films on Sn-xZn solder alloys
  Author : Jian-Chun Liu; Gong Zhang; Shijo Nagao; Jin-Ting Jiu; Masaya Nogi; Tohru Sugahara; Ju-Sheng Ma; Katsuaki Suganuma
  Journal : CORROSION SCIENCE
  Publication Date : 2015/10
• Highly Reliable Silver Nanowire Transparent Electrode Employing Selectively Patterned Barrier Shaped by Self-Masked Photolithography
  Author : Jun Wang; Jinting Jiu; Tohru Sugahara; Shijo Nagao; Masaya Nogi; Hirotaka Koga; Peng He; Katsuaki Suganuma; Hiroshi Uchida
  Journal : ACS APPLIED MATERIALS & INTERFACES
  Publication Date : 2015/10
• Solidification and thermal degradation of printable, stretchable electrical conductor from waterborne polyurethane and silver flakes
  Author : Hui-Wang Cui; Jin-Ting Jiu; Tohru Sugahara; Shijo Nagao; Katsuaki Suganuma; Hiroshi Uchida; Katsunori Kihara
  Journal : JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY
  Publication Date : 2015/10
• Growth and Extension of One-Step Sol-Gel Derived Molybdenum Trioxide Nanorods via Controlling Citric Acid Decomposition Rate
  Author : Shuren Cong; Tohru Sugahara; Tingting Wei; Jinting Jiu; Yukiko Hirose; Shijo Nagao; Katsuaki Suganuma
  Journal : CRYSTAL GROWTH & DESIGN
  Publication Date : 2015/09
• Heel crack propagation mechanism of cold-rolled Cu/Al clad ribbon bonding in harsh environment
  Author : Semin Park; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma
  Journal : JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
  Publication Date : 2015/09
• Targeted kinetic strategy for improving the thermal conductivity of epoxy composite containing percolating multi-layer graphene oxide chains
  Author : T. Zhou; H. Koga; M. Nogi; T. Sugahara; S. Nagao; T. T. Nge; K. Suganuma; H-W. Cui; F. Liu; Y. Nishina
  Journal : EXPRESS POLYMER LETTERS
  Publication Date : 2015/07
• Surface modification of Cu flakes through Ag precipitation for low-temperature pressureless sintering bonding
  Author : S. W. Park; T. Sugahara; M. Hatamura; N. Kagami; S. Sakamoto; S. Nagao; K. Suganuma
  Journal : MATERIALS LETTERS
  Publication Date : 2015/07
• Ultra thermal stability of LED die-attach achieved by pressureless Ag stress-migration bonding at low temperature
  Author : Teppei Kunimune; Masafumi Kuramoto; Satoru Ogawa; Tohru Sugahara; Shijo Nagao; Katsuaki Suganuma
  Journal : ACTA MATERIALIA
  Publication Date : 2015/05
• High Performance Heat Curing Copper-Silver Powders Filled Electrically Conductive Adhesives
  Author : Hui-Wang Cui; Jin-Ting Jiu; Tohru Sugahara; Shijo Nagao; Katsuaki Suganuma; Hiroshi Uchida
  Journal : ELECTRONIC MATERIALS LETTERS
  Publication Date : 2015/03
• Low-temperature sintering of copper wiring by the high-frequency low-pressure plasma technology
  Author : 小泉 剛; 高 悦; 酒 金婷; 長尾 至成; 菅原 徹; 菅沼 克昭; 小嶋 保次; 鍋倉 俊哉; 浦川 顕一
  Journal : MES
  Publication Date : 2015
• Advanced Power Devises in Extreme Environments
  Author : 菅沼 克昭; 長尾 至成; 菅原 徹; 横井 絵美; 張 昊; 酒 金婷
  Journal : MES
  Publication Date : 2015
• High-temperature Reliability of Cu/Al Clad Ribbon Interconnections for WBG Semiconductor Power Devices
  Author : 朴 世珉; 長尾 至成; 菅原 徹; 横井 絵美; 菅沼 克昭
  Journal : MES
  Publication Date : 2015
• Sintering behavior of copper paste based on plasma techniques
  Author : 高 悦; 酒 金亭; 長尾 至成; 菅原 徹; 菅沼 克昭; 小泉 剛
  Journal : Proceedings of JIEP Annual Meeting
  Publication Date : 2015
• Silver Nanowire Electrodes: Conductivity Improvement Without Post-treatment and Application in Capacitive Pressure Sensors
  Author : Jun Wang; Jinting Jiu; Teppei Araki; Masaya Nogi; Tohru Sugahara; Shijo Nagao; Hirotaka Koga; Peng He; Katsuaki Suganuma
  Journal : NANO-MICRO LETTERS
  Publication Date : 2015/01
• A highly sensitive and flexible pressure sensor with electrodes and elastomeric interlayer containing silver nanowires
  Author : Jun Wang; Jinting Jiu; Masaya Nogi; Tohru Sugahara; Shijo Nagao; Hirotaka Koga; Peng He; Katsuaki Suganuma
  Journal : NANOSCALE
  Publication Date : 2015
• Facile identification of the critical content of multi-layer graphene oxide for epoxy composite with optimal thermal properties
  Author : Tianle Zhou; Shijo Nagao; Tohru Sugahara; Hirotaka Koga; Masaya Nogi; Katsuaki Suganuma; Thi Thi Nge; Yuta Nishina
  Journal : RSC ADVANCES
  Publication Date : 2015
• Nanoscale dynamic mechanical analysis on heat-resistant silsesquioxane nanocomposite for power-device packaging
  Author : Shijo Nagao; Naoki Fujisawa; Takuo Sugioka; Satoshi Ogawa; Teruhisa Fujibayashi; Takaaki Wada; Tohru Sugahara; Katsuaki Suganuma
  Journal : Materials Science Forum
  Publication Date : 2015
• The Effect of Ultraviolet Radiation on Silver Nanowire Transparent Electrode Based on Flexible Polymeric Film Substrate
  Author : Jun Wang; Jinting Jiu; Tohru Sugahara; Shijo Nagao; Masaya Nogi; Hirotaka Koga; Katsuaki Suganuma; Jun Wang; Peng He
  Journal : 2015 IEEE 15TH INTERNATIONAL CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO)
  Publication Date : 2015
• Using the Friedman method to study the thermal degradation kinetics of photonically cured electrically conductive adhesives
  Author : Hui-Wang Cui; Jin-Ting Jiu; Tohru Sugahara; Shijo Nagao; Katsuaki Suganuma; Hiroshi Uchida; Kurt A. Schroder
  Journal : JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY
  Publication Date : 2015/01
• Reliability of Silver Nanowire Transparent Electrode under Atmospheric Environment
  Author : Jinting Jiu; Jun Wang; Tohru Sugahara; Shijo Nagao; Masaya Nogi; Hirotaka Koga; Katsuaki Suganuma
  Journal : 2015 IEEE 15TH INTERNATIONAL CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO)
  Publication Date : 2015
• Fast fabrication of copper nanowire transparent electrodes by a high intensity pulsed light sintering technique in air
  Author : Su Ding; Jinting Jiu; Yanhong Tian; Tohru Sugahara; Shijo Nagao; Katsuaki Suganuma
  Journal : PHYSICAL CHEMISTRY CHEMICAL PHYSICS
  Publication Date : 2015
• Pressureless Ag thin-film die-attach for SiC devices
  Author : Chulmin Oh; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma
  Journal : Materials Science Forum
  Publication Date : 2015
• The effect of light and humidity on the stability of silver nanowire transparent electrodes
  Author : Jinting Jiu; Jun Wang; Tohru Sugahara; Shijio Nagao; Masaya Nogi; Hirotaka Koga; Katsuaki Suganuma; Masanao Hara; Eri Nakazawa; Hiroshi Uchida
  Journal : RSC ADVANCES
  Publication Date : 2015
• Fabrication of a flexible copper pattern based on a sub-micro copper paste by a low temperature plasma technique
  Author : Yue Gao; Hao Zhang; Jinting Jiu; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma
  Journal : RSC Advances
  Publication Date : 2015
• Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current
  Author : Youngseok Kim; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma; Minoru Ueshima; Hans-Juergen Albrecht; Klaus Wilke; Joerg Strogies
  Journal : JOURNAL OF ELECTRONIC MATERIALS
  Publication Date : 2014/12
• 'Chrysanthemum petal' arrangements of silver nano wires
  Author : Hui-Wang Cui; Jin-Ting Jiu; Tohru Sugahara; Shijo Nagao; Katsuaki Suganuma; Hiroshi Uchida
  Journal : NANOTECHNOLOGY
  Publication Date : 2014/12
• Hillock growth dynamics for Ag stress migration bonding
  Author : Chulmin Oh; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma
  Journal : MATERIALS LETTERS
  Publication Date : 2014/12
• Photoelectrical and microphysical properties of Sol-Gel derived IGZO thin films for printed TFTs
  Author : T. Matsuo; T. Sugahara; Y. Hirose; J. Jiu; S. Nagao; K. Suganuma; Jianying He; Zhiliang Zhang
  Journal : Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014
  Publication Date : 2014/11
• Nano-SiC added Ag paste sintering die-attach for SiC power devices
  Author : Hao Zhang; Shijo Nagao; Sungwon Park; Shunsuke Koga; Tohru Sugahara; Katsuaki Suganuma
  Journal : Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014
  Publication Date : 2014/11
• Sol-Gel-Derived High-Performance Stacked Transparent Conductive Oxide Thin Films
  Author : Tohru Sugahara; Yukiko Hirose; Shuren Cong; Hirotaka Koga; Jinting Jiu; Masaya Nogi; Shijo Nagao; Katsuaki Suganuma
  Journal : JOURNAL OF THE AMERICAN CERAMIC SOCIETY
  Publication Date : 2014/10
• Using Ozawa method to study the curing kinetics of electrically conductive adhesives
  Author : Hui-Wang Cui; Jin-Ting Jiu; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma; Hiroshi Uchida
  Journal : JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY
  Publication Date : 2014/09
• Thin-Film Copper Indium Gallium Selenide Solar Cell Based on Low-Temperature All-Printing Process
  Author : Manjeet Singh; Jinting Jiu; Tohru Sugahara; Katsuaki Suganuma
  Journal : ACS APPLIED MATERIALS & INTERFACES
  Publication Date : 2014/09
• Photonic sintering of thin film prepared by dodecylamine capped CuInxGa1 (-) Se-x(2) nanoparticles for printed photovoltaics
  Author : Manjeet Singh; Jinting Jiu; Tohru Sugahara; Katsuaki Suganuma
  Journal : THIN SOLID FILMS
  Publication Date : 2014/08
• Enhanced reliability of Sn-Ag-Bi-In joint under electric current stress by adding Co/Ni elements
  Author : Youngseok Kim; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma; Minoru Ueshima; Hans-Juergen Albrecht; Klaus Wilke; Joerg Strogies
  Journal : JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
  Publication Date : 2014/07
• Mechanical stabilities of ultrasonic Al ribbon bonding on electroless nickel immersion gold finished Cu substrates (vol 53, 04EP06, 2014)
  Author : Semin Park; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma
  Journal : JAPANESE JOURNAL OF APPLIED PHYSICS
  Publication Date : 2014/06
• Mechanical stabilities of ultrasonic Al ribbon bonding on electroless nickel immersion gold finished Cu substrates (vol 53, 04EP06, 2014)
  Author : Semin Park; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma
  Journal : JAPANESE JOURNAL OF APPLIED PHYSICS
  Publication Date : 2014/06
• Mechanical stabilities of ultrasonic Al ribbon bonding on electroless nickel immersion gold finished Cu substrates
  Author : Semin Park; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma
  Journal : JAPANESE JOURNAL OF APPLIED PHYSICS
  Publication Date : 2014/04
• Effect of electromigration on mechanical shock behavior in solder joints of surface mounted chip components
  Author : Youngseok Kim; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma; Minoru Ueshima; Hans-Juergen Albrecht; Klaus Wilke; Joerg Strogies
  Journal : JAPANESE JOURNAL OF APPLIED PHYSICS
  Publication Date : 2014/04
• Uniformly connected conductive networks on cellulose nanofiber paper for transparent paper electronics
  Author : Hirotaka Koga; Masaya Nogi; Natsuki Komoda; Thi Thi Nge; Tohru Sugahara; Katsuaki Suganuma
  Journal : NPG ASIA MATERIALS
  Publication Date : 2014/03
• Low haze transparent electrodes and highly conducting air dried films with ultra-long silver nanowires synthesized by one-step polyol method
  Author : Teppei Araki; Jinting Jiu; Masaya Nogi; Hirotaka Koga; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma
  Journal : NANO RESEARCH
  Publication Date : 2014/02
• Examination of the synthetic conditions and joining properties of Ag nanoparticles
  Author : 小賀 俊輔; 長尾 至成; 酒 金婷; 菅原 徹; 菅沼 克昭
  Journal : MES
  Publication Date : 2014
• The properties improvement of Ag paste sintering by adding SiC particles
  Author : 張 昊; 長尾 至成; 朴 聖源; 菅原 徹; 菅沼 克昭
  Journal : MES
  Publication Date : 2014
• Partial transient liquid phase bonding for high-temperature power electronics using Sn/Zn/Sn sandwich structure solder
  Author : S. W. Park; S. Nagao; T. Sugahara; Y. Katoh; H. Ishino; K. Sugiura; K. Suganuma
  Journal : CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems, Proceedings
  Publication Date : 2014
• Low-Pressure Sintering Bonding with Cu and CuO Flake Paste for Power Devices
  Author : S. W. Park; R. Uwataki; S. Nagao; T. Sugahara; Y. Katoh; H. Ishino; K. Sugiura; K. Tsuruta; K. Suganuma
  Journal : 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
  Publication Date : 2014
• Silver nanowire: synthesis, conductivity improvement and application to pressure sensor
  Author : Jun Wang; Teppei Araki; Jinting Jiu; Tohru Sugahara; Masaya Nogi; Shijo Nagao; Hirotaka Koga; Katsuaki Suganuma
  Journal : 2014 IEEE 14TH INTERNATIONAL CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO)
  Publication Date : 2014
• Mitigation of Sn Whisker Growth by Small Bi Additions
  Author : Jung-Lae Jo; Shijo Nagao; Kyoko Hamasaki; Masanobu Tsujimoto; Tohru Sugahara; Katsuaki Suganuma
  Journal : JOURNAL OF ELECTRONIC MATERIALS
  Publication Date : 2014/01
• Pressure-less Plasma Sintering of Cu Paste for SiC Die-Attach of High-Temperature Power Device Manufacturing
  Author : S. Nagao; K. Kodani; S. Sakamoto; S. -W. Park; T. Sugahara; K. Suganuma
  Journal : 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
  Publication Date : 2014
• Evaluation of Stretchable Conductor for Measuring Clothing Pressure
  Author : Katsunari Sato; Sayasa Otsubo; Teppei Araki; Tohru Sugahara; Katsuaki Suganuma
  Journal : HAPTICS: NEUROSCIENCE, DEVICES, MODELING, AND APPLICATIONS, PT II
  Publication Date : 2014
• Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics
  Author : Hui-Wang Cui; Jin-Ting Jiu; Shijo Nagao; Tohru Sugahara; Katsuaki Suganuma; Hiroshi Uchida; Kurt A. Schroder
  Journal : RSC ADVANCES
  Publication Date : 2014
• Facile synthesis of very-long silver nanowires for transparent electrodes
  Author : J. Jiu; T. Araki; J. Wang; M. Nogi; T. Sugahara; S. Nagao; H. Koga; K. Suganuma; E. Nakazawa; M. Hara; H. Uchida; K. Shinozaki
  Journal : JOURNAL OF MATERIALS CHEMISTRY A
  Publication Date : 2014
• Retarding intermetallic compounds growth of Zn high-temperature solder and Cu substrate by trace element addition
  Author : S. W. Park; Shijo Nagao; Tohru Sugahara; Keun Soo Kim; Katsuaki Suganuma
  Journal : Journal of Materials Science: Materials in Electronics
  Publication Date : 2013/12
• Thermal stress driven Sn whisker growth: in air and in vacuum
  Author : Jung-Lae Jo; Shijo Nagao; Tohru Sugahara; Masanobu Tsujimoto; Katsuaki Suganuma
  Journal : JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
  Publication Date : 2013/10
• Least lead addition to mitigate tin whisker for ambient storage
  Author : Jung Lae Jo; Keun Soo Kim; Tohru Sugahara; Shijo Nagao; Kyoko Hamasaki; Masanobu Tsujimoto; Katsuaki Suganuma
  Journal : Journal of Materials Science: Materials in Electronics
  Publication Date : 2013/08
• High thermal stability of optical transparency in cellulose nanofiber paper
  Author : Masaya Nogi; Changjae Kim; Tohru Sugahara; Tetsuji Inui; Tsukasa Takahashi; Katsuaki Suganuma
  Journal : Applied Physics Letters
  Publication Date : 2013/05
• Ag nanowires: large-scale synthesis via a trace-salt-assisted solvothermal process and application in transparent electrodes
  Author : Jinting Jiu; Tohru Sugahara; Masaya Nogi; Katsuaki Suganuma
  Journal : JOURNAL OF NANOPARTICLE RESEARCH
  Publication Date : 2013/04
• High-strength Si wafer bonding by self-regulated eutectic reaction with pure Zn
  Author : S. W. Park; T. Sugahara; S. Nagao; K. Suganuma
  Journal : SCRIPTA MATERIALIA
  Publication Date : 2013/04
• Microstructural stability of Ag sinter joining in thermal cycling
  Author : Soichi Sakamoto; Tohru Sugahara; Katsuaki Suganuma
  Journal : JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
  Publication Date : 2013/04
• Optimization of process conditions in Ag Direct Bonding
  Author : 呉 哲旼; 長尾 至成; 菅原 徹; 菅沼 克昭
  Journal : Proceedings of Microelectronics Symposium
  Publication Date : 2013
• Interfacial reaction of Zn-0.1Cr high temperature solder and Cu/Ni substrates
  Author : 朴 聖源; 長尾 至成; 菅原 徹; 菅沼 克昭
  Journal : Proceedings of Microelectronics Symposium
  Publication Date : 2013
• La doped effects on structure and thermoelectric properties of Sr2MnMoO6 double-perovskite oxides
  Author : Tohru Sugahara; Michitaka Ohtaki; Katsuaki Suganuma
  Journal : Journal of Asian Ceramic Societies
  Publication Date : 2013
• Electrically conductive bacterial cellulose composite membranes produced by the incorporation of graphite nanoplatelets in pristine bacterial cellulose membranes
  Author : T. Zhou; D. Chen; J. Jiu; T. T. Nge; T. Sugahara; S. Nagao; H. Koga; M. Nogi; K. Suganuma; X. Wang; X. Liu; P. Cheng; T. Wang; D. Xiong
  Journal : Express Polymer Letters
  Publication Date : 2013
• Oxidation Resistance and Joining Properties of Cr-doped Zn Bonding for SiC Die-attachment
  Author : S. W. Park; T. Sugahara; S. Nagao; K. Suganuma
  Journal : 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
  Publication Date : 2013
• Cu salt ink formulation for printed electronics using photonic sintering
  Author : Teppei Araki; Tohru Sugahara; Jinting Jiu; Shijo Nagao; Masaya Nogi; Hirotaka Koga; Hiroshi Uchida; Kenji Shinozaki; Katsuaki Suganuma
  Journal : Langmuir
  Publication Date : 2013
• Silver Nanowires Transparent Conductive Films: Fabrication Using Different Sintering Techniques
  Author : Jinting Jiu; Tohru Sugahara; Masaya Nogi; Shijo Nagao; Katsuaki Suganuma
  Journal : 2013 13TH IEEE CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO)
  Publication Date : 2013
• High-intensity pulse light sintering of silver nanowire transparent films on polymer substrates: the effect of the thermal properties of substrates on the performance of silver films
  Author : Jinting Jiu; Tohru Sugahara; Masaya Nogi; Teppei Araki; Katsuaki Suganuma; Hiroshi Uchida; Kenji Shinozaki
  Journal : NANOSCALE
  Publication Date : 2013
• Ag/TiO2 core-shell nanocables prepared with a one-step polyol process
  Author : Jinting Jiu; Masaya Nogi; Tohru Sugahara; Katsuaki Suganuma; Masahiko Tsujimoto; Seiji Isoda
  Journal : JOURNAL OF NANOPARTICLE RESEARCH
  Publication Date : 2012/11
• Effect of Void Volume and Silver Loading on Strain Response of Electrical Resistance in Silver Flakes/Polyurethane Composite for Stretchable Conductors
  Author : Teppei Araki; Tohru Sugahara; Masaya Nogi; Katsuaki Suganuma
  Journal : JAPANESE JOURNAL OF APPLIED PHYSICS
  Publication Date : 2012/11
• Enhanced ductility and oxidation resistance of Zn through the addition of minor elements for use in wide-gap semiconductor die-bonding materials
  Author : S. W. Park; T. Sugahara; K. S. Kim; K. Suganuma
  Journal : JOURNAL OF ALLOYS AND COMPOUNDS
  Publication Date : 2012/11
• Strongly adhesive and flexible transparent silver nanowire conductive films fabricated with a high-intensity pulsed light technique
  Author : Jinting Jiu; Masaya Nogi; Tohru Sugahara; Takehiro Tokuno; Teppei Araki; Natsuki Komoda; Katsuaki Suganuma; Hiroshi Uchida; Kenji Shinozaki
  Journal : JOURNAL OF MATERIALS CHEMISTRY
  Publication Date : 2012/11
• Chalcopyrite CuGaTe2: A High-Efficiency Bulk Thermoelectric Material
  Author : Theerayuth Plirdpring; Ken Kurosaki; Atsuko Kosuga; Tristan Day; Samad Firdosy; Vilupanur Ravi; G. Jeffrey Snyder; Adul Harnwunggmoung; Tohru Sugahara; Yuji Ohishi; Hiroaki Muta; Shinsuke Yamanaka
  Journal : ADVANCED MATERIALS
  Publication Date : 2012/07
• High-temperature thermoelectric properties of non-stoichiometric Agi(1-x)InTe(2) with chalcopyrite structure
  Author : Y. Aikebaier; K. Kurosaki; T. Sugahara; Y. Ohishi; H. Muta; S. Yamanaka
  Journal : MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS
  Publication Date : 2012/07
• Effect of the Amount of Vacancies on the Thermoelectric Properties of Cu-Ga-Te Ternary Compounds
  Author : Theerayuth Plirdpring; Ken Kurosaki; Atsuko Kosuga; Manabu Ishimaru; Adul Harnwunggmoung; Tohru Sugahara; Yuji Ohishi; Hiroaki Muta; Shinsuke Yamanaka
  Journal : MATERIALS TRANSACTIONS
  Publication Date : 2012/07
• Structure and thermoelectric properties of double-perovskite oxides: Sr2-xKxFeMoO6
  Author : Tohru Sugahara; Teppei Araki; Michitaka Ohtaki; Katsuaki Suganuma
  Journal : JOURNAL OF THE CERAMIC SOCIETY OF JAPAN
  Publication Date : 2012/06
• Transparent Electrodes Fabricated via the Self-Assembly of Silver Nanowires Using a Bubble Template
  Author : Takehiro Tokuno; Masaya Nogi; Jinting Jiu; Tohru Sugahara; Katsuald Suganuma
  Journal : LANGMUIR
  Publication Date : 2012/06
• Structure and thermoelectric properties of Ca2-xSrxFeMoO6 (0 <= x <= 0.3) double-perovskite oxides
  Author : Tohru Sugahara; Ngo Van Nong; Michitaka Ohtakic
  Journal : MATERIALS CHEMISTRY AND PHYSICS
  Publication Date : 2012/04
• Thermodynamic equilibrium calculations on the oxidation behavior of the Mo-Ru-Rh-Pd alloys
  Author : Yuji Ohishi; Ken Kurosaki; Tohru Sugahara; Aikebaier Yusufu; Yusuke Masahira; Hiroaki Muta; Shinsuke Yamanaka; Satoshi Komamine; Toshiki Fukui; Eiji Ochi
  Journal : Transactions of the Atomic Energy Society of Japan
  Publication Date : 2012/03
• Fabrication of transparent conductive films with Ag nanowires on plastic films
  Author : Takehiro Tokuno; Katsuaki Sucianuma; Teppei Araki; Jinting Jiu; Tohru Sugahara; Masaya Nogi; Hiroshi Uchida; Kenji Shinozaki
  Journal : IDW/AD '12: PROCEEDINGS OF THE INTERNATIONAL DISPLAY WORKSHOPS, PT 1
  Publication Date : 2012
• Effects of additional Ni and Co on microstructural evolution in Sn-Ag-Bi-In solder under current stressing
  Author : Youngseok Kim; Torhu Sugahara; Shijo Nagao; Katsuaki Suganuma; Minoru Ueshima; Hans-Juergen Albrecht; Klaus Wilke; Joerg Strogies
  Journal : 2012 2ND IEEE CPMT SYMPOSIUM JAPAN
  Publication Date : 2012
• Thermoelectric properties and microstructures of AgSbTe2-added p-type Pb0.16Ge0.84Te
  Author : Aikebaier Yusufu; Ken Kurosaki; Tohru Sugahara; Yuji Ohishi; Hiroaki Muta; Shinsuke Yamanaka
  Journal : PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE
  Publication Date : 2012/01
• SiC Die-attachment with Minor Elements Added Pure Zn under Formic Acid Reflow
  Author : S. W. Park; J. L. Jo; T. Sugahara; M. Ueshima; H. Iwamoto; K. Suganuma
  Journal : 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)
  Publication Date : 2012
• Influence of tin plating thickness on whisker growth during thermal cycling
  Author : Jung-Lae Jo; Tohru Sugahara; Masanobu Tsujimoto; Katsuaki Suganuma
  Journal : 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)
  Publication Date : 2012
• Fabrication of transparent conductive films with Ag nanowires on plastic films
  Author : Tokuno, T; Suganuma, K; Araki, T; Jiu, J; Sugahara, T; Nogi, M; Uchida, H; Shinozaki, K
  Publication Date : 2012
• Thermoelectric properties of Ag1-xGaTe2 with chalcopyrite structure
  Author : Aikebaier Yusufu; Ken Kurosaki; Atsuko Kosuga; Tohru Sugahara; Yuji Ohishi; Hiroaki Muta; Shinsuke Yamanaka
  Journal : APPLIED PHYSICS LETTERS
  Publication Date : 2011/08
• Structural and semiconductor-to-metal transitions of double-perovskite cobalt oxide Sr2-xLaxCoTiO6-delta with enhanced thermoelectric capability
  Author : Tohru Sugahara; Michitaka Ohtaki
  Journal : APPLIED PHYSICS LETTERS
  Publication Date : 2011/08
• Thermoelectric properties of Ga-added CoSb3 based skutterudites
  Author : Adul Harnwunggmoung; Ken Kurosaki; Theerayuth Plirdpring; Tohru Sugahara; Yuji Ohishi; Hiroaki Muta; Shinsuke Yamanaka
  Journal : JOURNAL OF APPLIED PHYSICS
  Publication Date : 2011/07
• Synthesis and thermal conductivities of ZnIn2Te4 and CdIn2Te4 with defect-chalcopyrite structure
  Author : Tawat Suriwong; Ken Kurosaki; Somchai Thongtem; Adul Harnwunggmoung; Theerayuth Plirdpring; Tohru Sugahara; Yuji Ohishi; Hiroaki Muta; Shinsuke Yamanaka
  Journal : JOURNAL OF ALLOYS AND COMPOUNDS
  Publication Date : 2011/07
• High-temperature thermoelectric properties of Cu2Ga4Te7 with defect zinc-blende structure
  Author : Theerayuth Plirdpring; Ken Kurosaki; Atsuko Kosuga; Manabu Ishimaru; Adul Harnwunggmoung; Tohru Sugahara; Yuji Ohishi; Hiroaki Muta; Shinsuke Yamanaka
  Journal : APPLIED PHYSICS LETTERS
  Publication Date : 2011/04
• Synthesis and high-temperature thermoelectric properties of Ni3GaSb and Ni3InSb
  Author : Tawat Suriwong; Ken Kurosaki; Somchai Thongtem; Adul Harnwunggmoung; Tohru Sugahara; Theerayuth Plirdpring; Yuji Ohishi; Hiroaki Muta; Shinsuke Yamanaka
  Journal : JOURNAL OF ALLOYS AND COMPOUNDS
  Publication Date : 2011/03
• Phase state and physical properties of the Mo-Ru-Ph-Pd alloys
  Author : Tohru Sugahara; Ken Kurosaki; Aikebaier Yusufu; Hiroaki Muta; Yuji Ohishi; Shinsuke Yamanaka; Satoshi Komamine; Eiji Ochi
  Journal : Materials Research Society Symposium Proceedings
  Publication Date : 2011
• Thermoelectric properties of double-perovskite oxide Sr2-xMxFeMoO6 (M = Ba, La)
  Author : Tohru Sugahara; Michitaka Ohtaki; Takeshi Souma
  Journal : JOURNAL OF THE CERAMIC SOCIETY OF JAPAN
  Publication Date : 2008/12

Books etc

• Thin Film and Flexible Thermoelectric Generators, Devices and Sensors
  Author : Yusufu Ekubaru; Tohru Sugahara
  Publisher : Springer International Publishing
  Publication Date : 2020